AMD Carrizo APU "Mobile" Platform Details Unveiled

AMD'southward Carrizo APU "Mobile" platform specifications and details have been unveiled in a slide posted by VR-Zone. The slide confirms pretty much everything we have known nigh Carrizo and will cease much of the confusion that has been build around the information regarding AMD's 5th generation of accelerated processing units for their mobile platforms. AMD Carrizo APU Platform Details

The platform details regarding AMD Carrizo APU take been unveiled for the Mobile platform rather the desktop platform simply we volition believe that the desktop platform volition be like in terms of compages and pattern every bit was with Kaveri generation of processors, earlier this year. If you await at the picture of the slide posted past VR-Zone, you volition notation that information technology is very like to the SteamrollerB powered Kaveri 2.0 platform slide which was leaked well-nigh 8 months ago and turned out to be true at the time of Kaveri's launch since most of the details reported were accurate.

AMD's Carrizo APU would get the fifth installment in the Accelerated Processing Units family which volition feature the latest Excavator core architecture. From previous leaks, we have come up to know that Excavator is based on a 28nm process probably based on GlobalFoundaries since AMD chose information technology the node for Kaveri likewise. Powering the CPU side, these new x86 Excavator modular cores will leverage the IPC for greater functioning compared to Steamroller. The mobile platform volition feature both Quad Core and Dual Cadre variants simply correct now, nosotros are looking at a glimpse of the top-cease variant which shares 2 MB L2 cache.

Prior to this leak, rumors revealed that Carrizo will feature 30% performance increase over Kaveri generation of processors which we thought was pure speculation at best but the slide conspicuously mentions a 30% increase at only 15W power input which is pretty impressive. Additionally, AMD will also add AVX2, BMI2, MOVBE and RDRAND back up to the instruction gear up which brings the extension feature fix shut to Intel'south Haswell. Since the targeted platforms for these APUs are notebooks, all-in-ones and convertibles, they will be shipped in BGA )FP4) package and volition ship in variants ranging in TDPs of 12/15/35W.

On the GPU side, nosotros have the third Generation GCN (Volcanic Islands) cadre which is a swell plus bespeak for this level of APU. You should keep in mind that the Volcanic Islands graphics isn't the codename for AMD's Radeon R200 lineup but infact used to denote their flagship Hawaii based chips. This is a central hint that AMD'south adjacent generation flagship parts would accept the same improved GCN compages currently fused only inside the Hawaii fries which characteristic true AMD Curtain, AMD TrueAudio and AMD OpenCL optimizations. The integrated graphics would nonetheless be based on the 28nm process and its hard to say whether the Compute Unit count will increment in the Carrizo APU generation of products. Nosotros will definitely see an improved and efficient blueprint which will allow faster clock speeds on these great integrated chips which make many upcoming games run off without the need of a discrete graphics card at decent detail quality.

The graphics die will still characteristic viii Compute Units which announce 512 stream processors forth with higher memory efficiency which will deliver improve performance throughput since APUs are by and large bandwidth starved, Delta color compression and characteristic full HSA support with a high-functioning integrated coach for graphics and DRAM along side some software enhancements such as Fine-grain preemption for context switches and in add-on to Mantle, characteristic support for DirectX 12 API too.

The about interesting thing about Carrizo, bated from its technical specifications is as well the design of the chip itself. AMD for the first time is aiming for a truthful SOC design eliminating the need of a separate FCH equally was the example with Kaveri mobile which requires Bolton FCH for additional connectivity options. The FCH volition be integrated on the die itself which will deliver Security, Brandish, Audio, PCI-eastward, SATA, SD, USB, Multimedia, UART/12C. CLCKGen and Misc I/O connectivity. AMD is aiming for UVD6, VCE3 and a audio co-processors with H.264 encode while feature a display control engine "DCE11". With HDMI two.0 that provides upwards to iii brandish interfaces and PCI-due east Gen 3.0 x8 for discrete GPU expansion and PCI-due east 3.0 x4 for GPP, the APU begins to wait like a decent comeback over Kaveri from a design perspective. The FCH tin can deliver 4 USB iii.0 / 2.0 ports, 4 USB 2.0 ports and 2 SATA 3 ports while the memory controller permit for Dual Aqueduct DDR3 memory rated at 2133 MHz in SoDIMM form cistron (One per channel).

AMD will release Carrizo APU next yr in 2022 which will feature both mobile and desktop platforms. The mobile platform is targeted as a SOC while desktop fries will be compatible with FM2+ socket with the A88X "Bolton" FCH. Rumors have pointed out to a FM3 motherboard which will allow simultaneous back up for DDR3 and DDR4 retentivity while some have fifty-fifty pointed to stacked DRAM for the APU which will leverage the graphics output on the processor yet we cannot confirm this at the moment and then its meliorate to await for more details to popular up in the future.

AMD Carrizo APU (Mobile/Desktop) Comparing Chart:

	AMD Trinity APU	AMD Richland APU	AMD Kaveri APU	AMD Carrizo APU
Core	x86 Piledriver	x86 Piledriver	x86 Steamroller	x86 Excavator
Cores	two-4	2-4	ii-4	ii-iv
GPU	HD 7000 VLIW4	Hd 8000 VLIW4	2d GCN Sea Islands	tertiary GCN Volcanic Islands
GCN Cores	384 SPs	384 SPs	512 SPs	512 SPs
Chipset	A85X/A75/FCH	A88X/A78/FCH	A88X/A78/Bolton	A88X/A78/SOC
Socket	FM2/FM2+/BGA	FM2/FM2+/BGA	FM2+/BGA	FM2+/BGA
Memory	DDR3	DDR3	DDR3	DDR3
TDP	17/25/35W	17/25/35W	17/19/35W	12/fifteen/35W
HSA Support	No	No	Yes	Total